For use with the thermistor and ceramic heater on the X3 & X4 series hotends

GD900 thermal paste has tiny particle diameter metal oxide as the main raw materials it's used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system.

Product features: Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive.

Working principle: Filling the gap between heating elements and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect.